Th E T A 3

Third International Conference on
 Thermal Issues in Emerging Technologies
Theory and Application - ThETA 3
Cairo, Egypt, December 19th-22nd 2010

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Papers in IEEE/Xplore | Selected papers in ASME/J. Heat Transfer , ASME/J. Electronic Packagging
This year, ThETA is co-located with International Conference on Microelectronics ICM'2010
OBJECTIVES: Emerging Technologies in various domains, including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical engin., New Energies ..., all raise issues related to thermal effects and interactions. Their importance is continuously increasing, tending to be a dominant factor in new technologies.

The first two rounds have gathered participants from eminent academic and industrial institutions around the world: (see also sites of ThETA 2, ThETA 1 )
Papers presented by region ThETA1 ThETA2
Asia (mainly Japan, S. Korea ...) 10 18
USA & Canada 7 17
Europe (mainly Italy, France ...) 14 17
Arab world 6 11

TOPICS
  • Micro and nano-scale heat transfer, Microfluidics
  • Modeling of multiple scale heat transfer problems
  • Thermal modeling of electronic systems
  • Temperature aware computer systems design
  • Cooling of electronic systems and data centers
  • Compact thermal models
  • Thermo-mechanical effects
  • MEMS – multi-physics problems
  • New and renewable energies
  • Solid state energy generation / cooling
  • Fuel cells
  • Energy conservation
  • Energy – Buildings - Environment
  • Multiphase flow with heat transfer
  • Thermal issues in biomedical engineering
  • Thermal issues in micro-fabrication technology
  • Thermal issues in new materials
  • Computational methods in heat transfer
  • Experimental methods in heat transfer



Venue
Cairo, Egypt


of

Papers in IEEE/Xplore
Selected papers in special journal issues of:
IEEE/Components & Packaging Technologies
ASME/Journal of Electronic Packaging
DEADLINES  
Submitting abstracts
May 30th 2010
Notification of abstract acceptance June 27th 2010
Submitting full papers Aug. 15th 2010
Notification of paper acceptance Oct. 3rd 2010
Camera Ready full paper Nov. 3rd 2010
ORGANIZED BY

SPONSORED BY
Heat Transfer Society
of Japan


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