Yogendra Joshi

Yogendra Joshi is McKenney/Shiver Distinguished Chair and Associate Chair for Graduate Studies at the G.W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology.  He is involved in research and instruction in the area of thermal engineering associated with emerging technologies.  Prior to joining the Georgia Institute of Technology in Fall 2001, he held academic positions at the University of Maryland at College Park (1993-2001) and the Naval Postgraduate School (1996-1993).  He received a Bachelor of Technology degree in Mechanical Engineering from the Indian Institute of Technology in Kanpur in 1979,  Master of Science in Mechanical Engineering from the State University of New York, Buffalo in 1981, and a Doctor of Philosophy in Mechanical Engineering and Applied Mechanics, from the University of Pennsylvania in 1984. He is the author or co-author of 150 journal articles and conference papers.  He has been Associate Technical Editor of the American Society of Mechanical Engineers (ASME) Journal of Electronic Packaging (1996-2001) and Journal of Heat Transfer (2005-2008). He has served as an academic advisor to over thirty graduate students.  He is an elected Fellow of the ASME and the American Association for the Advancement of Science.  He was a co-recipient of the 1999 ASME Curriculum Innovation Award. In 2001 he received an Inventor Recognition Award from the Semiconductor Research Corporation

Wataru Nakayama

Dr. Wataru Nakayama received his Doctor of Engineering degree from the Tokyo Institute of Technology in 1966.  In 1970 he began a twenty-year strong career with Hitachi's Mechanical Engineering Research Laboratory.  While at Hitachi, he conducted and supervised heat transfer research for a wide range of products including heat exchangers and computers.  In 1989, he became the Hitachi Chair Professor at the Tokyo Institute of Technology (TIT), a position he held until his retirement in 1996.  At TIT he taught and conducted research on microelectronic packaging with a focus on power and thermal management of computers. After his retirement from TIT he served as a visiting professor at the University of Maryland until 2001.  He is currently an independent engineering consultant. Dr. Nakayama has been active in the international professional societies.  He co-chaired and helped organize several international conferences.  He wrote extensively on thermal management of electronic equipment, and authored and co-authored several books on the subject.  He has received many prominent awards, including the ASME Heat Transfer Memorial Award (1992), the ICHMT Fellowship Award (1996), the ASME Electrical and Electronic Packaging Division Award (1996), the JSME Award for Longstanding Contributions to Mechanical Engineering (1997), the ITHERM Achievement Award (2000), and the InterPack Achievement Award (2001).  Dr. Nakayama is a Fellow of ASME, a Fellow of IEEE, a Life Member of JSME, an Honorary Member of the Heat Transfer Society of Japan.

Mohamed-Nabil Sabry

Mohamed-Nabil SABRY is the Director of the Center of Research, Development and International Cooperation, in the French University in Egypt. He has received his first engineering degree with honors from Ain Shams University, Egypt, 1976 and his Doctorat ès Sciences degree, from INPG (Institut National Polytechnique de Grenoble), France 1984. He has conducted an extensive research work in modeling and simulation of various problems, with a particular emphasis on thermal issues in electronic systems, both in academic and industrial environments (He was the engineering manager of analog simulation in Mentor Graphics). He was awarded the Harvey Rosten Award for excellence in Electro-Thermal analysis 2002. He is a Member of the program committee of many conferences (THERMINIC, EuroSimE and ITHERM). He has been an invited speaker in many conferences (EuroSime, Brussels; TherminIC, Nice; IEEE VTS, California ...).

Bahgat Sammakia

Bahgat Sammakia is Director of the Integrated Electronics Engineering Center and is the executive director for economic development at Binghamton University. He received his Bachelor of Science degree in Mechanical Engineering in 1977, from the University of Alexandria in Egypt. He received the masters and doctorate degrees in mechanical engineering in 1980 and 82 respectively from the State University of New York at Buffalo. His research work was in the areas of natural convection heat transfer. After graduating from SUNY, Bahgat worked at the University of Pennsylvania as a postdoctoral fellow. Bahgat joined IBM in 1984 and was promoted in 1985 to manager of the thermal management department. Bahgat continued to work in IBM until 1998, in various management positions, including managing the thermal and mechanical analysis groups, the surface science group, the chemical lab, the site technical assurance group, and his last position in IBM was manager of development for organic packaging in the IBM Microelectronics division. Bahgat holds twelve US patents and twelve IBM technical disclosures; he has published over seventy technical papers in refereed journals and conference proceedings. Bahgat has contributed to three books on natural convection heat transfer and electronic packaging. Bahgat is an ASME fellow and is the editor of the Journal of Electronic Packaging, Transactions of the ASME. Bahgat is a member of the Board of Directors of Sheltered Workshop Solutions SWS, the board of directors of the SUNY Research Foundation, the board of industrial advisors of the Cornell Materials Research Center, and is a Vice president and a member of the Board of Directors of the Southern Tier Opportunities Coalition STOC.

Ali Shakouri

Prof. Ali Shakouri is a Professor of Electrical Engineering at the University of California, Santa Cruz. He is actually the head of the Quantum Electronics Group. He has his Diplome d'Ingenieur June 1990 from the Ecole Nationale Superiere des Telecommunications, Paris, France. He obtained his Ph.D., July 1995 from California Institute of Technology Pasadena, CA. His fields of Study cover: Quantum electronics, nano and microscale heat and current transport in semiconductor devices, thermoelectric/thermionic energy conversion, submicron thermal imaging, micro refrigerators on a chip and novel optoelectronic integrated circuits. Packard Fellowship in Science and Engineering 1999 NSF CAREER Award 2000