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Th E T A 3	Third International Conference on Thermal Issues in Emerging Technologies Theory and Application - *ThETA 3* Cairo, Egypt, December 19^th-22^nd 2010

OBJECTIVES: Emerging Technologies in various domains, including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical engin., New Energies ..., all raise issues related to thermal effects and interactions. Their importance is continuously increasing, tending to be a dominant factor in new technologies.

The first two rounds have gathered participants from eminent academic and industrial institutions around the world: (see also sites of ThETA 2, ThETA 1 )

Papers presented by region	ThETA1	ThETA2
Asia (mainly Japan, S. Korea ...)	10	18
USA & Canada	7	17
Europe (mainly Italy, France ...)	14	17
Arab world (mainly Egypt)	6	11
Total no. of papers	37	63

TOPICS

Micro and nano-scale heat transfer, Microfluidics
Modeling of multiple scale heat transfer problems
Thermal modeling of electronic systems
Temperature aware computer systems design
Cooling of electronic systems and data centers
Compact thermal models
Thermo-mechanical effects
MEMS – multi-physics problems
New and renewable energies
Solid state energy generation / cooling
Fuel cells
Energy conservation
Energy – Buildings - Environment
Multiphase flow with heat transfer
Thermal issues in biomedical engineering
Thermal issues in micro-fabrication technology
Thermal issues in new materials
Computational methods in heat transfer
Experimental methods in heat transfer

This year, ThETA is co-located with International Conference on Microelectronics ICM'2010

Venue
Cairo, Egypt

Papers in IEEE/Xplore
Selected papers in special journal issues of:
IEEE/Components & Packaging Technologies
ASME/Journal of Electronic Packaging
ASME/Journal of Heat Transfer

DEADLINES

Submitting full papers Extended

Oct. 3^rd 2010

Notification of paper acceptance

Oct. 17^th 2010

Camera Ready full paper

Nov. 3^rd 2010