Second International Conference on
Thermal Issues in Emerging Technologies
Theory and Application - ThETA 2
Cairo, Egypt, December 17th-20th 2008

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OBJECTIVES

Emerging Technologies in various domains, including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical engineering as well as New Energies, all raise many issues related to thermal effects and interactions. The importance of such effects is continuously increasing to a point where they become a dominant factor in determining the performance of such technologies.

The first round, ThETA1 , was held in Cairo Jan 3rd – 6th 2007. A total of 72 persons have participated from around the globe (Japan: 9; S. Korea: 8; USA: 7; Canada: 4; Europe: 12; …), representing leading universities and research labs as well as Industries. They have enjoyed sharing their experience ( see reactions) in this new event.

Parallel to the conference, a set of workshops will be conducted, aiming at disseminating advances made in different areas to the academic and industrial public in Egypt, fostering network creation with renowned international research centers as well as giving an impulse to academic/industrial cooperation.

TOPICS

  • Thermal modeling of electronic systems
  • Temperature aware computer systems design
  • Cooling of electronic systems and data centers
  • Micro and Nano scale heat transfer
  • Modeling of multiple scale heat transfer problems
  • Compact thermal models
  • Thermo-mechanical analysis in electronic systems
  • MEMS – multiphysical problems
  • Computational methods in heat transfer
  • Energy conservation
  • Fuel cells
  • Solid state energy generation / cooling
  • Multiphase flow with heat transfer
  • Thermal issues in biomedical engineering (diagnosis – therapy – prosthesis)
  • Thermal Issues in Microfabrication Technology
  • Thermal issues in new materials
  • New experimental methods in heat transfer




Venue
Cairo, Egypt



of

Conference papers will appear in IEEE-Xplore

Selected papers will appear in special journal issues of:
IEEE/Components & Packaging Technologies
ASME/Journal of Electronic Packaging

DEADLINES  
Submitting abstracts
June 2nd 2008
Notification of abstract acceptance June 16th 2008
Submitting full papers Sep. 8th 2008
Notification of paper acceptance Oct. 6th 2008
Camera Ready full paper Nov. 3rd 2008

CONFERENCE SPONSORS





Heat Transfer Society
of Japan


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